JPH0143708Y2 - - Google Patents
Info
- Publication number
- JPH0143708Y2 JPH0143708Y2 JP1983048407U JP4840783U JPH0143708Y2 JP H0143708 Y2 JPH0143708 Y2 JP H0143708Y2 JP 1983048407 U JP1983048407 U JP 1983048407U JP 4840783 U JP4840783 U JP 4840783U JP H0143708 Y2 JPH0143708 Y2 JP H0143708Y2
- Authority
- JP
- Japan
- Prior art keywords
- film
- circuit
- round
- hole
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000003486 chemical etching Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983048407U JPS59152767U (ja) | 1983-03-30 | 1983-03-30 | スル−ホ−ル基板用回路焼付フイルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983048407U JPS59152767U (ja) | 1983-03-30 | 1983-03-30 | スル−ホ−ル基板用回路焼付フイルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59152767U JPS59152767U (ja) | 1984-10-13 |
| JPH0143708Y2 true JPH0143708Y2 (en]) | 1989-12-19 |
Family
ID=30178938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983048407U Granted JPS59152767U (ja) | 1983-03-30 | 1983-03-30 | スル−ホ−ル基板用回路焼付フイルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59152767U (en]) |
-
1983
- 1983-03-30 JP JP1983048407U patent/JPS59152767U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59152767U (ja) | 1984-10-13 |
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